Computer Simulation of Metal Ions Transport to Uneven Substrates during Ionized Plasma Vapour Deposition

We present a computational study of processes taking place in a sheath region formed near a negatively biased uneven substrate during ionized plasma vapour deposition. The sputtered metal atoms are ionized on their way to substrate and they are accelerated in the sheath near the substrate. They are...

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Bibliographic Details
Main Authors: Tomáš Ibehej, Jakub Hromádka, Rudolf Hrach
Format: Article
Language:English
Published: Wiley 2017-01-01
Series:Advances in Materials Science and Engineering
Online Access:http://dx.doi.org/10.1155/2017/4283547
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