Influence of Package Parasitic Parameters on Transient Current Distribution of Paralleled IGBT Chips
High power IGBT usually use multiple chips in parallel to achieve large current. The consistency of the dynamic and static current distribution of parallel chips is essential to improve the current level and reliability of devices.At first, the difference of package parasitic parameters caused by in...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
State Grid Energy Research Institute
2019-08-01
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| Series: | Zhongguo dianli |
| Subjects: | |
| Online Access: | https://www.electricpower.com.cn/CN/10.11930/j.issn.1004-9649.201805131 |
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