Reducing solidification cracks and enhancing mechanical performance in additively manufactured Cu-Ti alloys via chemical fluctuation manipulation

Reducing solidification cracks and enhancing mechanical performance in additively manufactured Cu-Ti alloys via chemical fluctuation manipulation

Additive manufacturing offers substantial design freedom for developing copper (Cu) alloy components with complex shapes. However, the extreme process conditions of this technique increase the risk of solidification cracking. Cu-titanium (Ti) alloy, a high-strength Cu alloy, exhibited solidification...

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Bibliographic Details
Main Authors: Qi Liu, Shengxi Jin, Chuanxi Ren, Dongdong Zhang, Ze Pu, Hongning Wen, Yating Ran, Xingdong Dan, Xuanlai Chen, Song Ni, Jing Lu, Zibin Chen
Format: Article
Language:English
Published: Taylor & Francis Group 2025-12-01
Series:Virtual and Physical Prototyping
Subjects:
Laser powder bed fusion
copper alloy
solidification crack
chemical fluctuation
cellular microstructure
Online Access:https://www.tandfonline.com/doi/10.1080/17452759.2025.2522274
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https://www.tandfonline.com/doi/10.1080/17452759.2025.2522274

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