Influence of Initial Gap, Voltage, and Additives on Zinc Microcolumn Morphology by Local Electrochemical Deposition

Local electrochemical deposition (LECD) is an innovative additive manufacturing technology capable of achieving precise deposition of metallic microstructures. This study delves into the ramifications of pivotal operational parameters—namely, the initial electrode gap, deposition voltage, and additi...

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Bibliographic Details
Main Authors: Yi Liu, Fuliang Wang
Format: Article
Language:English
Published: MDPI AG 2025-01-01
Series:Sensors
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Online Access:https://www.mdpi.com/1424-8220/25/2/521
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Summary:Local electrochemical deposition (LECD) is an innovative additive manufacturing technology capable of achieving precise deposition of metallic microstructures. This study delves into the ramifications of pivotal operational parameters—namely, the initial electrode gap, deposition voltage, and additive concentration—on the morphology of zinc microcolumns fabricated through LECD. A holistic approach integrating experimental methodologies with finite element simulations was adopted to scrutinize the influence of these variables on the microcolumns’ dimensions, surface morphology, and structural integrity. The findings reveal that augmenting the initial electrode gap results in microcolumns with larger diameters. Conversely, the deposition voltage primarily modulates the formation rate without exerting a notable impact on the columns’ dimensional attributes. The incorporation of additives enhances surface smoothness and diminishes column diameters; however, an overabundance of additives adversely affects the overall microstructure. Optimal parameters for the production of high-quality zinc microcolumns were determined to be a deposition voltage of 3.4 V and an electrode gap of 10 μm. These discoveries contribute pivotal insights for the refinement of LECD processes, with particular relevance to biomedical applications, such as the development of zinc-based bioabsorbable materials for orthopedic implants and cardiovascular devices.
ISSN:1424-8220