Three-dimensional nano-structure investigation on a thermo- and electrical conductive adhesive via X-ray imaging
Nowadays, advancements in adhesion of huge amount of electronic components have evolved from using traditional soldering to conductive adhesives, notably silver-based ones, offering cost efficiency, health safety, and superior thermal conductivity, which is crucial for the increasing computational s...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-10-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X25010159 |
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