Dual Strategy of Electroless Metal Deposition and Surface Silylation Toward Scalable Low-Temperature Hybrid Bonding for Advanced Packaging Applications
The growing demand for high-performance computing and compact electronics has driven the transition toward advanced three-dimensional (3D) packaging technologies. Traditional packaging technologies, such as micro-bump interconnections, face limitations in achieving sub-micrometer pitches, prompting...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/11071665/ |
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