An Approach to Thermal Management and Performance Throttling for Federated Computation on a Low-Cost 3D ESP32-S3 Package Stack
The rise of 3D heterogeneous packaging holds promise for increased performance in applications such as AI by bringing compute and memory modules into close proximity. This increased performance comes with increased thermal management challenges. This research explores the use of thermal sensing and...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-04-01
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| Series: | Computers |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-431X/14/4/147 |
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