An Approach to Thermal Management and Performance Throttling for Federated Computation on a Low-Cost 3D ESP32-S3 Package Stack

An Approach to Thermal Management and Performance Throttling for Federated Computation on a Low-Cost 3D ESP32-S3 Package Stack

The rise of 3D heterogeneous packaging holds promise for increased performance in applications such as AI by bringing compute and memory modules into close proximity. This increased performance comes with increased thermal management challenges. This research explores the use of thermal sensing and...

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Bibliographic Details
Main Authors: Yi Liu, Parth Sandeepbhai Shah, Tian Xia, Dryver Huston
Format: Article
Language:English
Published: MDPI AG 2025-04-01
Series:Computers
Subjects:
package stack heating
3D heterogeneous integration
federated computing
artificial intelligence
thermal control
throttling
Online Access:https://www.mdpi.com/2073-431X/14/4/147
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