A wafer-level sealed silicon cavity microacoustic platform for radio frequency integration
Abstract This study presents a wafer-level sealed silicon cavity (SSC) microacoustic integration platform to address the limitations in the cavity Silicon-on-Insulator (C-SOI) wafers for the 5G/6G wireless communication system. The proposed SSC platform features an extremely smooth suspended membran...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Publishing Group
2025-05-01
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| Series: | Microsystems & Nanoengineering |
| Online Access: | https://doi.org/10.1038/s41378-025-00958-8 |
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