Sintered metal alloy and composite as bonding materials for electronics applications
Sintered silver (Ag) offers excellent thermal and mechanical properties for high-temperature electronic packaging but faces adoption barriers due to high cost and electrochemical migration. Sintered copper (Cu), a cheaper alternative, is limited by its oxidation susceptibility. To overcome these iss...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-09-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425020320 |
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| author | W.J. Wang Anuttam Patra Ling Xin Yong Xu Long Qiang Jia Lu Shen K.S. Siow |
| author_facet | W.J. Wang Anuttam Patra Ling Xin Yong Xu Long Qiang Jia Lu Shen K.S. Siow |
| author_sort | W.J. Wang |
| collection | DOAJ |
| description | Sintered silver (Ag) offers excellent thermal and mechanical properties for high-temperature electronic packaging but faces adoption barriers due to high cost and electrochemical migration. Sintered copper (Cu), a cheaper alternative, is limited by its oxidation susceptibility. To overcome these issues, recent research explores the combination of Ag- and Cu-based sintering to leverage the benefits of both metals. The technology can be further enhanced with functional additives, sometimes combined with intermetallic-based transient liquid phase sintering strategies. This review critically examines their synthesis methods, mechanical performance, and processing challenges, with a particular focus on key properties such as shear strength, thermal conductivity, and electrical resistivity. The benefits of Ag–Cu based sintered joints, especially their superior thermal performance and mechanical robustness, are highlighted. Additionally, combining Ag and Cu in sinter pastes enhances oxidation resistance through the thermal stability of Ag and improves structural reliability by leveraging mechanical strength and cost-effectiveness of Cu. Ultimately, this review provides insights into the potential of sintered Ag–Cu metal interconnect as high-performance and lead-free bonding materials. |
| format | Article |
| id | doaj-art-4d24442c2a2044d696ce7f4af6589770 |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-09-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-4d24442c2a2044d696ce7f4af65897702025-08-22T04:56:45ZengElsevierJournal of Materials Research and Technology2238-78542025-09-01382766278110.1016/j.jmrt.2025.08.079Sintered metal alloy and composite as bonding materials for electronics applicationsW.J. Wang0Anuttam Patra1Ling Xin Yong2Xu Long3Qiang Jia4Lu Shen5K.S. Siow6Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Bangi, Selangor, MalaysiaChemistry of Interfaces Group, Luleå University of Technology, Luleå, 97187, Sweden; Corresponding author.School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798School of Mechanics and Transportation Engineering, Northwestern Polytechnical University, Xi'an, 710072, ChinaSchool of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, ChinaProfessional Officers Division, Singapore Institute of Technology, 1 Punggol Coast Road, 828608 SingaporeInstitute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia; Corresponding author.Sintered silver (Ag) offers excellent thermal and mechanical properties for high-temperature electronic packaging but faces adoption barriers due to high cost and electrochemical migration. Sintered copper (Cu), a cheaper alternative, is limited by its oxidation susceptibility. To overcome these issues, recent research explores the combination of Ag- and Cu-based sintering to leverage the benefits of both metals. The technology can be further enhanced with functional additives, sometimes combined with intermetallic-based transient liquid phase sintering strategies. This review critically examines their synthesis methods, mechanical performance, and processing challenges, with a particular focus on key properties such as shear strength, thermal conductivity, and electrical resistivity. The benefits of Ag–Cu based sintered joints, especially their superior thermal performance and mechanical robustness, are highlighted. Additionally, combining Ag and Cu in sinter pastes enhances oxidation resistance through the thermal stability of Ag and improves structural reliability by leveraging mechanical strength and cost-effectiveness of Cu. Ultimately, this review provides insights into the potential of sintered Ag–Cu metal interconnect as high-performance and lead-free bonding materials.http://www.sciencedirect.com/science/article/pii/S2238785425020320Electrochemical migrationBonding materialsSintered silverSintered copper |
| spellingShingle | W.J. Wang Anuttam Patra Ling Xin Yong Xu Long Qiang Jia Lu Shen K.S. Siow Sintered metal alloy and composite as bonding materials for electronics applications Journal of Materials Research and Technology Electrochemical migration Bonding materials Sintered silver Sintered copper |
| title | Sintered metal alloy and composite as bonding materials for electronics applications |
| title_full | Sintered metal alloy and composite as bonding materials for electronics applications |
| title_fullStr | Sintered metal alloy and composite as bonding materials for electronics applications |
| title_full_unstemmed | Sintered metal alloy and composite as bonding materials for electronics applications |
| title_short | Sintered metal alloy and composite as bonding materials for electronics applications |
| title_sort | sintered metal alloy and composite as bonding materials for electronics applications |
| topic | Electrochemical migration Bonding materials Sintered silver Sintered copper |
| url | http://www.sciencedirect.com/science/article/pii/S2238785425020320 |
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