Sintered metal alloy and composite as bonding materials for electronics applications
Sintered silver (Ag) offers excellent thermal and mechanical properties for high-temperature electronic packaging but faces adoption barriers due to high cost and electrochemical migration. Sintered copper (Cu), a cheaper alternative, is limited by its oxidation susceptibility. To overcome these iss...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425020320 |
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