APA (7th ed.) Citation

Wang, W., Patra, A., Yong, L. X., Long, X., Jia, Q., Shen, L., & Siow, K. Sintered metal alloy and composite as bonding materials for electronics applications. Elsevier.

Chicago Style (17th ed.) Citation

Wang, W.J, Anuttam Patra, Ling Xin Yong, Xu Long, Qiang Jia, Lu Shen, and K.S Siow. Sintered Metal Alloy and Composite as Bonding Materials for Electronics Applications. Elsevier.

MLA (9th ed.) Citation

Wang, W.J, et al. Sintered Metal Alloy and Composite as Bonding Materials for Electronics Applications. Elsevier.