Ultra-fine quantitative removal of silicon materials by femtosecond laser
The development of miniaturized electronic devices is highly dependent on precision manufacturing techniques. To achieve device miniaturization, material removal and processing accuracy down to the submicrometer or even nanometer level are required. The precision machining of the mass block, a key c...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2024-12-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/5.0237422 |
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