Residual Stress in Cu Sputtered Films on Glass Substrates at Different Substrate Temperatures
Copper films of 300 nm thickness deposited by planar magnetron sputtering on glass substrates, for substrate temperatures between 300 and 500 K, and deposition rate of 10 ?s?1. Microstructure of these films was obtained by X-ray diffraction, while the texture mode of diffractometer was used for stre...
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| Format: | Article |
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| Language: | English |
| Published: |
University of Tehran
2004-09-01
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| Series: | Journal of Sciences, Islamic Republic of Iran |
| Online Access: | https://jsciences.ut.ac.ir/article_31608_f0038ac507f1b32ea9f29138954f9ab7.pdf |
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