The impact of sidewall copper grain condition on thermo-mechanical behaviors of TSVs during the annealing process

The impact of sidewall copper grain condition on thermo-mechanical behaviors of TSVs during the annealing process

Abstract With the drastic reduction of the TSV diameter leading to a critical dimension comparable to the Cu-filled grain size, the grain condition strongly influences the thermo-mechanical behavior of the TSV. In this work, the TSV-Cu cross-section with different grain sizes is characterized by EBS...

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Bibliographic Details
Main Authors: Yang Xi, Yunpeng Zhang, Zhiqaing Tian, Tianjian Liu, Can Sheng, Bo Zhao, Zhaofu Zhang, Shizhao Wang, Sheng liu
Format: Article
Language:English
Published: Nature Publishing Group 2024-12-01
Series:Microsystems & Nanoengineering
Online Access:https://doi.org/10.1038/s41378-024-00830-1
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