The impact of sidewall copper grain condition on thermo-mechanical behaviors of TSVs during the annealing process
Abstract With the drastic reduction of the TSV diameter leading to a critical dimension comparable to the Cu-filled grain size, the grain condition strongly influences the thermo-mechanical behavior of the TSV. In this work, the TSV-Cu cross-section with different grain sizes is characterized by EBS...
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| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Publishing Group
2024-12-01
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| Series: | Microsystems & Nanoengineering |
| Online Access: | https://doi.org/10.1038/s41378-024-00830-1 |
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