Essential Frequency Analysis for Stacked Cu-CNT Composite Cells of TSVs
This paper presents a comprehensive frequency analysis of copper-carbon nanotube (Cu-CNT) composite cells in stacked through-silicon vias (TSVs), focusing on a novel approach in which Cu-CNT composite cells are distributed normally within the TSVs. This distribution is designed to simulate real-worl...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
|
| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10909535/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|