Thermal Load Influence during the Formation of Al-Al Contacts on the Electrical Parameters of the Integrated Circuits with Aluminum-Polysilicon Contacts
This work is devoted to establishing the effect of using rapid thermal processing (RTP) method (450 °C, 7 s) to form an ohmic contact between two layers of aluminum metallization on the electrical parameters and reliability of integrated circuits. The resistance values of contact chains aluminum-sil...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | Russian |
| Published: |
Educational institution «Belarusian State University of Informatics and Radioelectronics»
2022-12-01
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| Series: | Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki |
| Subjects: | |
| Online Access: | https://doklady.bsuir.by/jour/article/view/3496 |
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