Integrated Electrochemical and Computational Elucidation of Nitro Blue Tetrazolium Chloride as an Efficient Leveler for Copper Microvia Superfilling
Levelers are indispensable additives for achieving void-free, bottom-up superconformal copper filling of microvias. Establishing the molecular-level correlation between leveler structure and performance is therefore essential to the continued advancement of microelectronic copper-plating technology....
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| Main Authors: | Dong Xing, Xiangfu Wei, Jinge Ye, Mingsong Lin, Shengchang Tang, Hui You |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-06-01
|
| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/6/721 |
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