Integrated Electrochemical and Computational Elucidation of Nitro Blue Tetrazolium Chloride as an Efficient Leveler for Copper Microvia Superfilling

Integrated Electrochemical and Computational Elucidation of Nitro Blue Tetrazolium Chloride as an Efficient Leveler for Copper Microvia Superfilling

Levelers are indispensable additives for achieving void-free, bottom-up superconformal copper filling of microvias. Establishing the molecular-level correlation between leveler structure and performance is therefore essential to the continued advancement of microelectronic copper-plating technology....

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Bibliographic Details
Main Authors: Dong Xing, Xiangfu Wei, Jinge Ye, Mingsong Lin, Shengchang Tang, Hui You
Format: Article
Language:English
Published: MDPI AG 2025-06-01
Series:Micromachines
Subjects:
microvias filling
electroplating leveler
copper electroplating
quantum chemical calculation
molecular dynamics simulations
Online Access:https://www.mdpi.com/2072-666X/16/6/721
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