The study on low temperature reflow of antioxidant multicomponent solder paste on copper substrates
Low-temperature solder joints play a critical role in advanced packaging technologies by minimizing heat input and expanding the processing window for assembly. The low-temperature solder paste consisting of SnBiIn-based solder nanoparticles is particularly promising due to its reflow temperatures a...
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| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-07-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425015303 |
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