Wu, Y., Jiang, L., Li, W., Zheng, J., Chen, Y., & Qian, L. Two material removal modes in chemical mechanical polishing: Mechanical plowing vs. chemical bonding. Tsinghua University Press.
Chicago Style (17th ed.) CitationWu, Yuan, Liang Jiang, Wenhui Li, Jiaxin Zheng, Yushan Chen, and Linmao Qian. Two Material Removal Modes in Chemical Mechanical Polishing: Mechanical Plowing Vs. Chemical Bonding. Tsinghua University Press.
MLA (9th ed.) CitationWu, Yuan, et al. Two Material Removal Modes in Chemical Mechanical Polishing: Mechanical Plowing Vs. Chemical Bonding. Tsinghua University Press.
Warning: These citations may not always be 100% accurate.