Two material removal modes in chemical mechanical polishing: mechanical plowing vs. chemical bonding
Abstract With the rapid development of semiconductors, the number of materials needed to be polished sharply increases. The material properties vary significantly, posing challenges to chemical mechanical polishing (CMP). Accordingly, the study aimed to classify the material removal mechanism. Based...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Tsinghua University Press
2023-12-01
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| Series: | Friction |
| Subjects: | |
| Online Access: | https://doi.org/10.1007/s40544-023-0799-6 |
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