Development of flip-chip technology for the optical drive of superconducting circuits [version 2; peer review: 1 approved, 2 approved with reservations]

We discuss the flip-chip mounting process of photodiodes and fiber sleeves on silicon substrates to meet the increasing demand for fabrication of highly integrated and hybrid quantum circuits for operation at cryogenic temperatures. To further increase the yield and success rate of the flip-chip pro...

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Bibliographic Details
Main Authors: Shekhar Priyadarshi, Marco Kraus, Alexander Fernandez Scarioni, Judith Felgner, Mark Bieler, Johannes Kohlmann, Hao Tian, Oliver Kieler
Format: Article
Language:English
Published: F1000 Research Ltd 2024-11-01
Series:Open Research Europe
Subjects:
Online Access:https://open-research-europe.ec.europa.eu/articles/4-97/v2
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