Topological approach for optimization of liquid cooled plate with different inlet/outlet parameters
In this paper, a numerical simulation method is used to optimize the topology of the liquid cooled plate structure in the heat dissipation module of IGBT chips. The paper takes the flow resistance minimization and heat transfer maximization as the dual objectives, and assigns weights to the objectiv...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-07-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X25004617 |
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