APA (7th ed.) Citation

Lin, H., Chiu, W., Chang, H., & Chen, C. In-situ AFM observation of enhanced thermal expansion in downscaled nanotwinned-Cu/SiO2 vias for 3D IC integration. Elsevier.

Chicago Style (17th ed.) Citation

Lin, Huai-En, Wei-Lan Chiu, Hsiang-Hung Chang, and Chih Chen. In-situ AFM Observation of Enhanced Thermal Expansion in Downscaled Nanotwinned-Cu/SiO2 Vias for 3D IC Integration. Elsevier.

MLA (9th ed.) Citation

Lin, Huai-En, et al. In-situ AFM Observation of Enhanced Thermal Expansion in Downscaled Nanotwinned-Cu/SiO2 Vias for 3D IC Integration. Elsevier.