In-situ AFM observation of enhanced thermal expansion in downscaled nanotwinned-Cu/SiO2 vias for 3D IC integration
Three-dimensional integrated circuit (3D IC) packaging offers viable solutions to sustain Moore's Law. Hybrid bonding, a key process in 3D IC packaging, enables high-density interconnections between stacked chips but faces fabrication challenges as the pitch continues to scale down. This study...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-05-01
|
| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425013353 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|