Estimation of Peak Junction Hotspot Temperature in Three-Level TNPC-IGBT Modules for Traction Inverters Through Chip-Level Modeling and Experimental Validation
Monitoring the peak junction hotspot temperature in IGBT modules is critical for ensuring the reliability of high-power industrial multilevel inverters, particularly when operating under extreme thermal conditions, such as in traction applications. This study presents a comprehensive chip-level anal...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-07-01
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| Series: | Energies |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1073/18/14/3829 |
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