APA (7th ed.) Citation

Yangang, W., Haihui, L., & Qiang, X. Progress and prospect of packaging of high-power semiconductor modules. Editorial Department of Electric Drive for Locomotives.

Chicago Style (17th ed.) Citation

Yangang, WANG, LUO Haihui, and XIAO Qiang. Progress and Prospect of Packaging of High-power Semiconductor Modules. Editorial Department of Electric Drive for Locomotives.

MLA (9th ed.) Citation

Yangang, WANG, et al. Progress and Prospect of Packaging of High-power Semiconductor Modules. Editorial Department of Electric Drive for Locomotives.