Progress and prospect of packaging of high-power semiconductor modules
The evolution of high-power semiconductor module is the most critical factor for upgrading of the power electronics system and development of the industry. In this paper, the updated progresses of power module products and packaging technology are reviewed according to the application fields, and th...
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2023-09-01
|
| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2023.05.008 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|