Study on the microstructure evolution and strengthening mechanism of Cu-Ni-Si alloy after two-stage rolling and aging

Study on the microstructure evolution and strengthening mechanism of Cu-Ni-Si alloy after two-stage rolling and aging

With the development of high-end integrated circuits toward higher integration and ultra-thin designs, the comprehensive performance requirements for Cu-Ni-Si alloys as lead frame materials continue to increase. In this paper, the microstructure of the alloy is optimized by adjusting the deformation...

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Bibliographic Details
Main Authors: Yunqi Shan, Yanmin Zhang, Chaomin Zhang, Jiang Feng, Baohuan Huang, Shiheng Zhao, Kexing Song
Format: Article
Language:English
Published: Elsevier 2025-06-01
Series:Materials & Design
Subjects:
Two-stage rolling aging
Microstructure properties
δ-Ni2Si phase
Dislocation density
Texture
Online Access:http://www.sciencedirect.com/science/article/pii/S0264127525003557
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