Study on the microstructure evolution and strengthening mechanism of Cu-Ni-Si alloy after two-stage rolling and aging
With the development of high-end integrated circuits toward higher integration and ultra-thin designs, the comprehensive performance requirements for Cu-Ni-Si alloys as lead frame materials continue to increase. In this paper, the microstructure of the alloy is optimized by adjusting the deformation...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-06-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127525003557 |
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