Manipulating the adhesion of electroless plated Cu film on liquid polymer crystal substrate for advanced microelectronic manufacturing
Summary: The evolution from subtractive to modified semi-additive (mSAP) and semi-additive (SAP) processes has heightened the importance of electroless plated (ELP) copper (Cu) peel strength in the printed circuit board industry. This study introduces a wet process for depositing Cu on liquid crysta...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-11-01
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| Series: | iScience |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2589004224023617 |
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