A study on connection mechanism between sintering silver paste for wide bandgap semiconductor and metalized substrate
Using sintering silver paste as an interconnect material for packaging can give full play to the advantages of wide bandgap semiconductors in device applications and improve the reliability of devices. By analyzing the microstructure, mechanical properties and failure modes of the pressureless silve...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2022-11-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2022.06.021 |
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