Modeling of Interface Defect Distribution for an n-MOSFETs Under Hot-Carrier Stressing

We propose to model the evolution of the interface defect density, induced by the hot-carrier-injection, during stress time for n-MOSFET transistor. This interface defect density is modeled by a spatial and temporal gaussian distribution centered close to the extremity of the channel near the drain....

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Main Authors: R. Marrakh, A. Bouhdada
Format: Article
Language:English
Published: Wiley 2000-01-01
Series:Active and Passive Electronic Components
Online Access:http://dx.doi.org/10.1155/APEC.23.137
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author R. Marrakh
A. Bouhdada
author_facet R. Marrakh
A. Bouhdada
author_sort R. Marrakh
collection DOAJ
description We propose to model the evolution of the interface defect density, induced by the hot-carrier-injection, during stress time for n-MOSFET transistor. This interface defect density is modeled by a spatial and temporal gaussian distribution centered close to the extremity of the channel near the drain. The gaussian Parameters (standard deviation and maximum) vary according to the stress. The stress generated defects leads to the degradation of the threshold voltage. The analysis of the threshold voltage evolution with stress time allows us to handle informations on the device performances degradation. The mathematic expression is simple so that the present model is suitable for circuit simulator.
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spelling doaj-art-2ddc7b046423457da38d5efc498ed8482025-08-20T03:18:27ZengWileyActive and Passive Electronic Components0882-75161563-50312000-01-0123313714410.1155/APEC.23.137Modeling of Interface Defect Distribution for an n-MOSFETs Under Hot-Carrier StressingR. Marrakh0A. Bouhdada1Laboratoire de Physique des Matériaux et de Microélectronique, Université Hassan II, Faculté des Sciences Aïn Chok, Km8; Route d'El Jadida, BP 5366 Maârif–Casablanca, MoroccoLaboratoire de Physique des Matériaux et de Microélectronique, Université Hassan II, Faculté des Sciences Aïn Chok, Km8; Route d'El Jadida, BP 5366 Maârif–Casablanca, MoroccoWe propose to model the evolution of the interface defect density, induced by the hot-carrier-injection, during stress time for n-MOSFET transistor. This interface defect density is modeled by a spatial and temporal gaussian distribution centered close to the extremity of the channel near the drain. The gaussian Parameters (standard deviation and maximum) vary according to the stress. The stress generated defects leads to the degradation of the threshold voltage. The analysis of the threshold voltage evolution with stress time allows us to handle informations on the device performances degradation. The mathematic expression is simple so that the present model is suitable for circuit simulator.http://dx.doi.org/10.1155/APEC.23.137
spellingShingle R. Marrakh
A. Bouhdada
Modeling of Interface Defect Distribution for an n-MOSFETs Under Hot-Carrier Stressing
Active and Passive Electronic Components
title Modeling of Interface Defect Distribution for an n-MOSFETs Under Hot-Carrier Stressing
title_full Modeling of Interface Defect Distribution for an n-MOSFETs Under Hot-Carrier Stressing
title_fullStr Modeling of Interface Defect Distribution for an n-MOSFETs Under Hot-Carrier Stressing
title_full_unstemmed Modeling of Interface Defect Distribution for an n-MOSFETs Under Hot-Carrier Stressing
title_short Modeling of Interface Defect Distribution for an n-MOSFETs Under Hot-Carrier Stressing
title_sort modeling of interface defect distribution for an n mosfets under hot carrier stressing
url http://dx.doi.org/10.1155/APEC.23.137
work_keys_str_mv AT rmarrakh modelingofinterfacedefectdistributionforannmosfetsunderhotcarrierstressing
AT abouhdada modelingofinterfacedefectdistributionforannmosfetsunderhotcarrierstressing