Thermal interface composite polymer materials
The subject of the article is the analysis and development of new thermally conductive composite polymer materials used for improved heat dissipation in electronics. The goal of the work is to create effective composites based on polyimides and silicone binders using aluminum nitride fillers. The us...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
National Aerospace University «Kharkiv Aviation Institute»
2025-03-01
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| Series: | Авіаційно-космічна техніка та технологія |
| Subjects: | |
| Online Access: | http://nti.khai.edu/ojs/index.php/aktt/article/view/2817 |
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