Nanoscale thermal transport at metal-semiconductor interfaces: size-dependent exponential scaling
As semiconductor manufacturing advances towards the sub-3 nm regime, understanding interfacial thermal transport becomes increasingly critical due to scaling-induced challenges in heat dissipation and material integration. In this study, we investigate nanoscale thermal transport at the copper/silic...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-09-01
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| Series: | Results in Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123025026994 |
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