System-Technology Co-Optimization for Dense Edge Architectures Using 3-D Integration and Nonvolatile Memory

System-Technology Co-Optimization for Dense Edge Architectures Using 3-D Integration and Nonvolatile Memory

High-performance edge artificial intelligence (Edge-AI) inference applications aim for high energy efficiency, memory density, and small form factor, requiring a design-space exploration across the whole stack—workloads, architecture, mapping, and co-optimization with emerging technology....

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Bibliographic Details
Main Authors: Leandro M. Giacomini Rocha, Mohamed Naeim, Guilherme Paim, Moritz Brunion, Priya Venugopal, Dragomir Milojevic, James Myers, Mustafa Badaroglu, Marian Verhelst, Julien Ryckaert, Dwaipayan Biswas
Format: Article
Language:English
Published: IEEE 2024-01-01
Series:IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Subjects:
3-D partitioning
edge artificial intelligence (Edge-AI)
nonvolatile memory (NVM)
system-technology co-optimization (STCO)
systolic array
voltage-gated spin-orbit torque (VGSOT)
Online Access:https://ieeexplore.ieee.org/document/10750212/
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