Research Progress of Package Interconnection Methods Based on Low-Temperature Sintered Silver
With the advancement of electronic power technology, power devices are constantly developing towards high power density and high integration. The interconnect layer, as a key channel for heat transfer in power modules, has an important impact on the realization of high-temperature and reliable appli...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2021-09-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2021.05.003 |
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