Investigation on the microstructure evolution and strengthening behavior of rolled bonding Cu strip

The relationship and influencing mechanism among the reduction rate, the strengthening behavior and the microstructure evolution of rolled Cu strips were studied. It was found that with the increase of reduction rate, the uneven deformation behavior of the Cu strip was divided into three zones. The...

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Bibliographic Details
Main Authors: Jun Cao, Junchao Zhang, Huiyi Tang, Xiaoyu Shen, Kexing Song, Yanjun Zhou, Chengqiang Cui
Format: Article
Language:English
Published: Elsevier 2025-03-01
Series:Journal of Science: Advanced Materials and Devices
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Online Access:http://www.sciencedirect.com/science/article/pii/S2468217924001667
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