Wafer-Level Packaging of Microelectromechanical Systems Based on Frame Structure

Wafer-Level Packaging of Microelectromechanical Systems Based on Frame Structure

Modern microelectromechanical systems (MEMS) are devices that incorporate microelectronic components and micromechanical structures on a single chip. Packaging is a mandatory stage in MEMS manufacturing. It ensures mechanical protection, sealing and transmission of electric energy and signals. The p...

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Bibliographic Details
Main Authors: E. S. Barbin, I. V. Kulinich, T. G. Nesterenko, A. N. Koleda, E. V. Shesterikov, P. F. Baranov, D. P. Il’yaschenko
Format: Article
Language:English
Published: Belarusian National Technical University 2024-12-01
Series:Приборы и методы измерений
Subjects:
mems
heterointegration
packaging
geodesic dome
Online Access:https://pimi.bntu.by/jour/article/view/903
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