Wafer-Level Packaging of Microelectromechanical Systems Based on Frame Structure
Modern microelectromechanical systems (MEMS) are devices that incorporate microelectronic components and micromechanical structures on a single chip. Packaging is a mandatory stage in MEMS manufacturing. It ensures mechanical protection, sealing and transmission of electric energy and signals. The p...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Belarusian National Technical University
2024-12-01
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| Series: | Приборы и методы измерений |
| Subjects: | |
| Online Access: | https://pimi.bntu.by/jour/article/view/903 |
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