Investigation into the evolution and failure mechanism of IMCs in Au wire bond interconnections under long-term wet heat conditions

Investigation into the evolution and failure mechanism of IMCs in Au wire bond interconnections under long-term wet heat conditions

This research analyzed the microstructure evolution, defect formation, and mechanical performance degradation mechanism of the bonding wire and Au-/Al interface with long-term exposure to 85 °C/85 %RH thermal-humidity bias (THB). The results showed that intermetallic compound (IMC) mainly appeared a...

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Bibliographic Details
Main Authors: Yaru Wu, Qinsong Bi, Shumeng Lu, Hongfu Yang, Shanju Zheng, Xiaohong Yuan, Jiaheng Zhang, Xiaojing Wang, Mengnie Li
Format: Article
Language:English
Published: Elsevier 2025-09-01
Series:Journal of Materials Research and Technology
Subjects:
Au wire bonding
Au–Al
Double 85 wet heat ageing
IMCs
Mechanical property
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785425020708
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