Investigation into the evolution and failure mechanism of IMCs in Au wire bond interconnections under long-term wet heat conditions
This research analyzed the microstructure evolution, defect formation, and mechanical performance degradation mechanism of the bonding wire and Au-/Al interface with long-term exposure to 85 °C/85 %RH thermal-humidity bias (THB). The results showed that intermetallic compound (IMC) mainly appeared a...
Saved in:
| Main Authors: | , , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-09-01
|
| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425020708 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|