Fabrication of Surface Level Cu/SiCp Nanocomposites by Friction Stir Processing Route
Friction stir processing (FSP) technique has been successfully employed as low energy consumption route to prepare copper based surface level nanocomposites reinforced with nanosized silicon carbide particles (SiCp). The effect of FSP parameters such as tool rotational speed, processing speed, and t...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2015-01-01
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| Series: | Journal of Nanotechnology |
| Online Access: | http://dx.doi.org/10.1155/2015/612617 |
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