VCSEL chip structure and packaging optimization design for high-power VCSEL light source modules

VCSEL chip structure and packaging optimization design for high-power VCSEL light source modules

The demand for high-power, high-density VCSEL light sources in applications such as space, artificial intelligence, silicon photonics, and autonomous vehicles is steadily increasing. VCSEL chips are epitaxially grown on GaAs substrates and then packaged by attaching them to a mounting bracket using...

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Bibliographic Details
Main Authors: Ching Lin Li, Wei Lai, Chi Wu Ke, Yuan Heng Cheng, Tzu Chieh Hsu, Chun Yi Lee, Chun Jung Chiu, Yen Heng Huang, Zhi Ting Ye
Format: Article
Language:English
Published: Taylor & Francis Group 2025-12-01
Series:International Journal of Optomechatronics
Subjects:
Vertical-cavity surface-emitting laser
artificial intelligence
silicon photonics
high efficiency
high power
low thermal resistance
Online Access:https://www.tandfonline.com/doi/10.1080/15599612.2025.2518922
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https://www.tandfonline.com/doi/10.1080/15599612.2025.2518922

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