A Novel Seal Packaging Structure Applied in Sub Miniature Push-On Connector Based on Ni47Ti44Nb9 Shape Memory Alloy Seal Ring
At present, the tin-lead vacuum soldering process is commonly used to complete the seal packaging of Sub miniature push-on (SMP) connectors. However, when the number of SMP connectors exceeds thousands, it is difficult to guarantee the consistency of soldering, which greatly restricts the large-scal...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/11122866/ |
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