Thermal stress behavior and optimization of solder joints in CSP-LED packages

Thermal stress behavior and optimization of solder joints in CSP-LED packages

This study explores the thermal stress behavior of chip-scale LED (CSP-LED) packages with a focus on micro/nanoscale interfacial effects and thermal transport under rapid temperature cycling. Finite element analysis (FEA), combined with advanced Taguchi optimization, identifies critical stress zones...

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Bibliographic Details
Main Authors: Jinlan Wang, Yaohui Deng, Zhao Zhang, Jiajie Jin, Peisheng Liu
Format: Article
Language:English
Published: Elsevier 2025-06-01
Series:Results in Engineering
Subjects:
Thermal stress
Micro/nanoscale interface
Finite element analysis
Thermal transport optimization
Solder joints
Online Access:http://www.sciencedirect.com/science/article/pii/S2590123025007893
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