Thermal stress behavior and optimization of solder joints in CSP-LED packages
This study explores the thermal stress behavior of chip-scale LED (CSP-LED) packages with a focus on micro/nanoscale interfacial effects and thermal transport under rapid temperature cycling. Finite element analysis (FEA), combined with advanced Taguchi optimization, identifies critical stress zones...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-06-01
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| Series: | Results in Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123025007893 |
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