Thermal stress behavior and optimization of solder joints in CSP-LED packages
This study explores the thermal stress behavior of chip-scale LED (CSP-LED) packages with a focus on micro/nanoscale interfacial effects and thermal transport under rapid temperature cycling. Finite element analysis (FEA), combined with advanced Taguchi optimization, identifies critical stress zones...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-06-01
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| Series: | Results in Engineering |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123025007893 |
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| _version_ | 1850262405804720128 |
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| author | Jinlan Wang Yaohui Deng Zhao Zhang Jiajie Jin Peisheng Liu |
| author_facet | Jinlan Wang Yaohui Deng Zhao Zhang Jiajie Jin Peisheng Liu |
| author_sort | Jinlan Wang |
| collection | DOAJ |
| description | This study explores the thermal stress behavior of chip-scale LED (CSP-LED) packages with a focus on micro/nanoscale interfacial effects and thermal transport under rapid temperature cycling. Finite element analysis (FEA), combined with advanced Taguchi optimization, identifies critical stress zones and evaluates the impact of void ratio, chip substrate material, solder layer thickness, and PCB substrate material on solder joint reliability. Results reveal that maximum equivalent stress concentrates at the solder layer's outer corners due to thermal mismatch. Key findings include the dominant role of PCB substrate material and microstructural void configurations in affecting interfacial stress. Optimal conditions, such as a void ratio of 0 %, a ceramic PCB, and a 40 μm solder layer, significantly enhance mechanical reliability. These insights contribute to advanced thermal management strategies for CSP-LEDs and other high-power electronics. |
| format | Article |
| id | doaj-art-178f45de922a475b902c668dc23bd75a |
| institution | OA Journals |
| issn | 2590-1230 |
| language | English |
| publishDate | 2025-06-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Results in Engineering |
| spelling | doaj-art-178f45de922a475b902c668dc23bd75a2025-08-20T01:55:11ZengElsevierResults in Engineering2590-12302025-06-012610471210.1016/j.rineng.2025.104712Thermal stress behavior and optimization of solder joints in CSP-LED packagesJinlan Wang0Yaohui Deng1Zhao Zhang2Jiajie Jin3Peisheng Liu4Archive Library, Nantong University, Nantong 226000, ChinaJiangsu Key Laboratory of Semiconductor Device and Integrated Circuit Design, Packaging and Testing, School of Information Science and Technology, Nantong University, Nantong 226019, ChinaJiangsu Key Laboratory of Semiconductor Device and Integrated Circuit Design, Packaging and Testing, School of Information Science and Technology, Nantong University, Nantong 226019, ChinaJiangsu Key Laboratory of Semiconductor Device and Integrated Circuit Design, Packaging and Testing, School of Information Science and Technology, Nantong University, Nantong 226019, ChinaDepartment of Information Technology, Xinglin College Nantong University, Nantong 226236, China; Jiangsu Key Laboratory of Semiconductor Device and Integrated Circuit Design, Packaging and Testing, School of Information Science and Technology, Nantong University, Nantong 226019, China; Corresponding author.This study explores the thermal stress behavior of chip-scale LED (CSP-LED) packages with a focus on micro/nanoscale interfacial effects and thermal transport under rapid temperature cycling. Finite element analysis (FEA), combined with advanced Taguchi optimization, identifies critical stress zones and evaluates the impact of void ratio, chip substrate material, solder layer thickness, and PCB substrate material on solder joint reliability. Results reveal that maximum equivalent stress concentrates at the solder layer's outer corners due to thermal mismatch. Key findings include the dominant role of PCB substrate material and microstructural void configurations in affecting interfacial stress. Optimal conditions, such as a void ratio of 0 %, a ceramic PCB, and a 40 μm solder layer, significantly enhance mechanical reliability. These insights contribute to advanced thermal management strategies for CSP-LEDs and other high-power electronics.http://www.sciencedirect.com/science/article/pii/S2590123025007893Thermal stressMicro/nanoscale interfaceFinite element analysisThermal transport optimizationSolder joints |
| spellingShingle | Jinlan Wang Yaohui Deng Zhao Zhang Jiajie Jin Peisheng Liu Thermal stress behavior and optimization of solder joints in CSP-LED packages Results in Engineering Thermal stress Micro/nanoscale interface Finite element analysis Thermal transport optimization Solder joints |
| title | Thermal stress behavior and optimization of solder joints in CSP-LED packages |
| title_full | Thermal stress behavior and optimization of solder joints in CSP-LED packages |
| title_fullStr | Thermal stress behavior and optimization of solder joints in CSP-LED packages |
| title_full_unstemmed | Thermal stress behavior and optimization of solder joints in CSP-LED packages |
| title_short | Thermal stress behavior and optimization of solder joints in CSP-LED packages |
| title_sort | thermal stress behavior and optimization of solder joints in csp led packages |
| topic | Thermal stress Micro/nanoscale interface Finite element analysis Thermal transport optimization Solder joints |
| url | http://www.sciencedirect.com/science/article/pii/S2590123025007893 |
| work_keys_str_mv | AT jinlanwang thermalstressbehaviorandoptimizationofsolderjointsincspledpackages AT yaohuideng thermalstressbehaviorandoptimizationofsolderjointsincspledpackages AT zhaozhang thermalstressbehaviorandoptimizationofsolderjointsincspledpackages AT jiajiejin thermalstressbehaviorandoptimizationofsolderjointsincspledpackages AT peishengliu thermalstressbehaviorandoptimizationofsolderjointsincspledpackages |